The MSI LB1000 laser bonding equipment provides superior process control and feedback through the use of a closed-loop control system. The system features integrated infrared temperature sensors and laser power sensors.
The LB1000 controls the wattage of the CO2 laser and the temperature of the bond site. With these controls, the bonding process is repeatable not just cycle-to-cycle, but also machine-to-machine. The LB1000 also features a column-shaped beam with user-defined width. Compared to pointed and linear beams, the column-shape contacts the product more consistently, even with bent mandrels.
The LB1000 includes a PLC control system with a user-friendly, PC touch screen interface. Process development and product changeover are intuitive. The flexible process sequence builder allows the user to tailor the process to their specific bonding needs. Additional user-friendly features include drop-in product handling, barcode scanning, integrated vision assist, and jog controls for easy bond site alignment to the laser column. Applications include proximal/distal balloon bonds, soft tip attachment, and other catheter/tube bonding processes.